Skip to content Skip to footer

Wafer-Scale Packaging and Integration Are Credited for New Generation of Low-Cost MEMS Motion Sensor Products

Published by: TDK Invensense

This paper will describe a new approach coming to the market that will break the barrier to creating the ideal in motion sensors with the promise to meet market needs in size, performance, and cost.
This unique new approach comes from the patented MEMS fabrication process with vertical integration of MEMS with CMOS electronics that achieves wafer-scale packaging to enable a generation of motion sensing products that meet market demand.
Download this whitepaper to find out more.

Read More

By submitting this form you agree to TDK Invensense contacting you with marketing-related emails or by telephone. You may unsubscribe at any time. TDK Invensense web sites and communications are subject to their Privacy Notice.

By requesting this resource you agree to our terms of use. All data is protected by our Privacy Notice. If you have any further questions please email

Related Categories: , , ,

digital route logo
Published: September 21, 2020 Lang: ENG
Type: Whitepaper Length: 6 pages

More resources from TDK Invensense