Components
ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS
This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced...
ISOLATION TRANSFORMERS FOR BATTERY MANAGEMENT SYSTEMS
Unfortunately, due to inverters, actuators, semiconductor switches, relays and other electromagnetic...
IMPLEMENTING PCI EXPRESS BRIDGING SOLUTIONS IN AN FPGA
Like its predecessor, the Peripheral Component Interconnect (PCI), PCI Express is becoming a ubiquitous...
Wide Temperature Range Fan “San Ace T” Series 9GT Type
In recent years, photovoltaic power generation, electric vehicles, etc. have spread rapidly from the...
THE NATURE OF WHITE RESIDUE ON PRINTED CIRCUIT ASSEMBLIES
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals...
DRAM MEMORY MODULE RANK CALCULATION
Each memory module has rank based on how DRAM chips are organized. A memory rank is a set of DRAM chips...
Factorized Power Architecture and VI Chips
As electronic systems continue to trend toward lower voltages with higher currents and as the speed of...
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