Embedded
Reducing CompactFlash Re-Qualification Time
Industrial grade CompactFlash (CF) has been a storage workhouse for embedded systems since the turn of...
Scalability in SNAP Mesh Networks
It is projected that 100 billion new “uniquely identifiable objects” will be connected to the Internet...
IoT Opportunity Demands New Approach to MCU-based Embedded Designs
Let's face it – the opportunity the IoT market offers is an unprecedented opportunity. The numbers...
Thermal Clad®
Fabrication of Thermal Clad is similar to traditional FR-4 circuit boards with regard to imaging and...
Output Power Measurement on Noise Sources
Noise sources used for noise figure and gain measurements are typically controlled by the spectrum analyzer...
Optimise beamforming: From bits to RF beams
Radar, satellite communications and 5G NR use AAS with phased array antennas for beamforming. Hybrid...
Key Considerations for Powertrain HIL Test
Safety, availability, and cost considerations can make performing thorough tests of embedded control...
Implementing Flexible USB Type-C Control Using FPGA Technology
Type-C interfaces bring dramatic benefits to consumers. However, in order to realize this potential designers...
The Need for Security
With the recent rise of the Internet of Things (IoT), 14 billion devices are now connected. However,...
Smart Sensors: Enabling the intelligent IoT
Engineers working on systems built using Internet of Things (IoT) technologies now have access to a huge...
MODELING OF SYNTHETIC JET EJECTORS FOR ELECTRONICS COOLING
This paper presents the modeling results for prediction of thermal performance using synthetic jets ejectors....
Sign up for Electronic Pro Tech Publish Hub
As a subscriber you will receive alerts and free access to our constantly updated library of white papers, analyst reports, case studies, web seminars and solution reports.