Processors
ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS
This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced...
2:1 MIPI CSI-2 Bridge Soft IP
In some cases, mobile Application Processors (AP) may not have enough interfaces to support the number...
Key Considerations for Powertrain HIL Test
Safety, availability, and cost considerations can make performing thorough tests of embedded control...
Computer-on-Module: selecting the right form factor and processor
When it comes to Computer-on-Module (COM) solutions for embedded computing applications, selecting the...
Material Advances Enable New Generation of Power Inductors
Designers building power inductors for today's highly volume mobile markets face a difficult dilemma....
XMOS Technology Whitepaper
Designers for electronic products are challenged by requests for customized and differentiated complex...
Redefining the Role of the RTOS
The world of embedded systems is undergoing a profound evolution. Once isolated and purpose-built, embedded...
OPTIMIZATION AND OVERHEAD
The intention of this paper is to analyze the overhead of memory used, while employing a C compiler as...
Factorized Power Architecture and V•I Chips
As electronic systems continue to trend toward lower voltages with higher currents and as the speed of...
Reducing Cost and Power in Consumer Applications Using PLDs
The need to respond to changing market standards in a compressed time to market window has led to the...
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