Processors
350V to12V DC “Yeaman Topology” Power System
This paper introduces a new DC/DC power supply architecture, called “Yeaman Topology”. The main characteristic...
ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS
This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced...
2:1 MIPI CSI-2 Bridge Soft IP
In some cases, mobile Application Processors (AP) may not have enough interfaces to support the number...
Modern Motor Control Applications and Trends
This paper reviews the state of the art of electric drives technology in three specific areas (a) technical...
FPGAs in Next Generation Wireless Networks
In addition to voice connectivity, digital cellular wireless networks such as GSM and its enhancement,...
eGaN® FETs in High Frequency Resonant Converters
In this white paper eGaN FET technology is applied in a high frequency resonant converter. Previously,...
Enabling Next Generation High Density Power Conversion
The drive to create Metadata processing server systems plus the parallel push for increased port density...
XMOS Technology Whitepaper
Designers for electronic products are challenged by requests for customized and differentiated complex...
The Benefits of Using Digital Power Modules
Digital power is one of the most important technologies for reducing power consumption and managing the...
SubLVDS to MIPI CSI-2 Image Sensor Interface Bridge Soft IP
Many Image Signal Processor (ISP) or Application Processors (AP) use the Mobile Industry Processor Interface...
NEW APPROACHES TO HARDWARE ACCELERATION USING ULTRA LOW DENSITY FPGAs
Ask system designers to list the problems they face – it doesn't matter whether they're building mobile...
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