LOW COST BOARD LAYOUT TECHNIQUES FOR DESIGNING WITH PLDS IN BGA PACKAGES
Programmable logic devices (PLDs) offer inherent time-to-market and design flexibility advantages over application specific integrated circuits (ASICs) and application specific standard products (ASSPs).
The increasing complexity of system requirements has driven the need to increase the logic density and I/O pins of PLDs. As a result, the Ball Grid Array (BGA) has become the package of choice for PLDs. BGA options such as chip scale BGA, fine pitch BGA and chip array BGA have largely replaced most quad flat package (QFP) options on most PLDs.
Download this whitepaper to learn more.
Read More
By submitting this form you agree to Lattice Semiconductor Corporation contacting you with marketing-related emails or by telephone. You may unsubscribe at any time. Lattice Semiconductor Corporation web sites and communications are subject to their Privacy Notice.
By requesting this resource you agree to our terms of use. All data is protected by our Privacy Notice. If you have any further questions please email dataprotection@techpublishhub.com
Related Categories: Capacitors, Embedded, Power, Resistors
More resources from Lattice Semiconductor Corporation
Flash Corruption: Software Bug or Supply Voltage Fault?
Flash memory is commonly used to store firmware in embedded systems. Occasionally, the firmware stored in the Flash memory in some systems is accid...
SubLVDS to MIPI CSI-2 Image Sensor Interface Bridge Soft IP
Many Image Signal Processor (ISP) or Application Processors (AP) use the Mobile Industry Processor Interface (MIPI® ) Camera Serial Interface 2 (C...
ENABLING MOBILE INTERFACE BRIDGING IN ADAS AND INFOTAINMENT APPLICATIONS
In the automotive market as in all industries, competition breeds innovation. Over the last 100 years, this truth has transformed the horseless car...
