Addressing Thermal Challenges in High‐Density Power Applications
Demand for more features and higher performance from ever-smaller form factors presents significant challenges for engineers developing applications such as DC-DC conversion, computing, industrial motor drives, and telecommunications. In many cases, for example, enhancing capabilities and functionality can lead to the need for larger components and, consequently, demand for more cooling. Forced-air cooling can be cumbersome, unreliable and inefficient. Passive cooling using heatsinks adds bulk and cost to the design and, ultimately, the end product. Thermal issues can, effectively, stop innovation in its tracks.
Read More
By submitting this form you agree to ON Semiconductor contacting you with marketing-related emails or by telephone. You may unsubscribe at any time. ON Semiconductor web sites and communications are subject to their Privacy Notice.
By requesting this resource you agree to our terms of use. All data is protected by our Privacy Notice. If you have any further questions please email dataprotection@techpublishhub.com
Related Categories: Components, Industrial, Power
More resources from ON Semiconductor
Modern Motor Control Applications and Trends
This paper reviews the state of the art of electric drives technology in three specific areas (a) technical requirements of high−performance ac m...
Addressing Thermal Challenges in High‐Density Power Applications
Demand for more features and higher performance from ever-smaller form factors presents significant challenges for engineers developing application...
Challenges of Implementing Industrial IoT Technology
The stage is now set for IoT to start seeing widespread deployment in both consumer and industrial spheres. The purpose of the following white pape...