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Addressing Thermal Challenges in High‐Density Power Applications

Published by: ON Semiconductor

Demand for more features and higher performance from ever-smaller form factors presents significant challenges for engineers developing applications such as DC-DC conversion, computing, industrial motor drives, and telecommunications. In many cases, for example, enhancing capabilities and functionality can lead to the need for larger components and, consequently, demand for more cooling. Forced-air cooling can be cumbersome, unreliable and inefficient. Passive cooling using heatsinks adds bulk and cost to the design and, ultimately, the end product. Thermal issues can, effectively, stop innovation in its tracks.

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Published: November 13, 2022 Lang: ENG
Type: Whitepaper Length: 5 pages

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