Skip to content Skip to footer

Computer-on-Module: selecting the right form factor and processor

When it comes to Computer-on-Module (COM) solutions for embedded computing applications, selecting the right form factor and processor for the application can be a challenging task for design engineers. COM solutions provide a cost-effective computer building block: a COM is a development board featuring a computer processor, chipset, cooler, heat sink, memory, ECC memory, secure boot, and peripherals – all designed into a single module. By specifying COMs, designers negate the necessity of building their own CPU core design, with all the time and cost that activity consumes.
Download this guide to learn how design engineers can optimise their COM solution choices!

Read More

By submitting this form you agree to [publishpress_authors_data field="display_name" post_id="$ID"] contacting you with marketing-related emails or by telephone. You may unsubscribe at any time. [publishpress_authors_data field="display_name" post_id="$ID"] web sites and communications are subject to their Privacy Notice.

By requesting this resource you agree to our terms of use. All data is protected by our Privacy Notice. If you have any further questions please email dataprotection@techpublishhub.com

digital route logo
Published: February 11, 2022 Lang: ENG
Type: Whitepaper Length: 7 pages

More resources from [publishpress_authors_data field="display_name" post_id="$ID"]