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Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

Published by: Kester Inc

In recent years tin-copper based solders with a variety of elemental additives have emerged which improve the overall properties and performance of tin-copper solders.
This paper is a summary of the experience at a medium sized assembler in achieving the customer driven mandate to go lead-free and the maintenance of production yields and quality using both tin-silver-copper and tin-copper in the assembly of high end printer boards. Over 120,000 builds were achieved with A 99.6% first pass yield for the overall soldering process.
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Published: April 8, 2021 Lang: ENG
Type: Whitepaper Length: 8 pages

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