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Communication and Isolation Technology for Integrated Gate Driver ICs

Published by: Power Integrations

New power semiconductors for high density applications require gate driver technologies that support higher working voltages and are reliable across an extended temperature range. The package must also meet international standards for creepage and clearance. This paper presents an innovative communication and isolation technology, integrated in a new industrial package design.

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Published: June 7, 2022 Lang: ENG
Type: Whitepaper Length: 12 pages

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