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Thermal Clad®

Fabrication of Thermal Clad is similar to traditional FR-4 circuit boards with regard to imaging and wet processing operations. However, secondary mechanical operations are unique, so the consideration of specific design recommendations are critical to ensure the manufacture of reliable, cost effective T-Clad circuits.
This white paper will address design recommendations for circuit image, soldermask, legend and mechanical fabrication. Additional consideration for trace widths, spacing and clearances may be required for electrical integrity based on application voltage.
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Published: August 3, 2021 Lang: ENG
Type: Whitepaper Length: 8 pages

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