Components
IEEE Reliability Society
This annual technology report of the IEEE Reliability Society is based on material submitted by the technical...
Selecting eGaNĀ® FET Optimal On-Resistance
Previously published articles showed that eGaN FETs behave for the most part just like silicon devices...
Design Considerations for High-Speed RS-485 Data Links
This article provides system designers new to high-speed RS-485 designs with an overview of standard...
Optimise beamforming: From bits to RF beams
Radar, satellite communications and 5G NR use AAS with phased array antennas for beamforming. Hybrid...
Choosing the Right RF Switches for Smart Mobile Device Applications
This paper will give an overview of both high and low throw-count RF switches used in different circuit...
The Journey of Sound
Portability creates unique challenges for audio engineers as they develop listening technologies, with...
Gate Drive Measurement Considerations
One of the primary purposes of a gate driver is to enable power switches to turn on and off faster, improving...
MINIATURE PUMPS
Miniature pumps are devices that utilize different technologies (diaphragm, gear, vane, peristaltic)...
Thermal Management for Surface-Mount Devices
The origins of the ambient derating curve go back decades to when the U.S. military specified the performance...
CCD QE in the Soft X-ray Range
e2v has previously provided back-illuminated CCDs for several solar observation projects, resulting in...
DRAM MEMORY MODULE RANK CALCULATION
Each memory module has rank based on how DRAM chips are organized. A memory rank is a set of DRAM chips...
High-Speed SERDES Interfaces In High Value FPGAs
Lattice Semiconductor has introduced two low cost FPGA families with SERDES, the LatticeECP2M, introduced...
Sign up for Electronic Pro Tech Publish Hub
As a subscriber you will receive alerts and free access to our constantly updated library of white papers, analyst reports, case studies, web seminars and solution reports.